Chip-on-board (COB) / Die-bonding

•  Assembly
•  Pull and shear test
•  Chip moulding

Die-bonding

•  Wafers up to 8''
•  Waffle pack
•  Traceability with data matrix or barcode
•  Programmable bond force

Wire bonding

•  Al wedge bonding       Wire ø 18-50 µm; Pitch 80 µm
•  Au wedge bonding      Wire ø 18-50 µm; Pitch 80 µm
•  Au ball bonding            Wire ø 18-50 µm; Pitch 60 µm
•  Au ribbon bonding       Wire e.g. 50 x 12 µm

Substrates

•  Printed circuit board
•  Ceramic
•  Flex
•  Wafer