Chip-on-board (COB) / Die-bonding
- Assembly
- Pull and shear test
- Chip moulding
Die-bonding
- Wafers up to 8''
- Waffle pack
- Traceability with data matrix or barcode
- Programmable bond force
Wire bonding
- Al wedge bonding Wire ø 18-50 µm; Pitch 80 µm
- Au wedge bonding Wire ø 18-50 µm; Pitch 80 µm
- Au ball bonding Wire ø 18-50 µm; Pitch 60 µm
- Au ribbon bonding Wire e.g. 50 x 12 µm
Substrates
- Printed circuit board
- Ceramic
- Flex
- Wafer
