In the case of Flip Chip technology, the chip is soldered with the contact side face-down, directly onto the substrate. The bumps are connected with the substrate by thermo-compression bonding, soldering or glueing.

•    Fluxing
•    Flipping and assembly
•    Reflow soldering
•    Underfill

Flip Chip design types

Flip Chip soldering                             Up to 180 µm pitch

Isotropic conductive

adhesion(ICA)                                      Up to 800 µm pitch

Anisotropic conductive

adhesion (ACA)                                   120µm pitch

Non-conductive adhesion (NCA)      80µm pitch

Ultrasonic                                              Max. 100 stud balls